Ultra-thin intermetallic compound formation in microbump technology by the control of a low Zn concentration in solder

Yingxia Liu*, Li Pu, Andriy Gusak, Xiuchen Zhao, Chengwen Tan, K. N. Tu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

7 Citations (Scopus)

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