Revealing evolutions of intermetallics in a solder joint under electromigration: A quasi-in situ study combining 3D microstructural characterization and numerical simulation

H. Y. Yuan, C. Li, H. Z. Zhang, M. Z. Fan, Z. L. Ma*, X. W. Cheng

*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

1 Citation (Scopus)

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