Packaging a top-cooled 650 V/150 A GaN power modules with insulated thermal pads and gate-drive circuit

Yu Yan*, Liyan Zhu, Jared Walden, Ziwei Liang, Hua Bai, Min H. Kao

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

7 Citations (Scopus)

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