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Highly efficient thermal decomposition of AP through intimately encapsulating in 3DOM CoFe2O4 spinel
Desheng Yang, Chaofei Bai, Fengdan Zhu, Chang Liu, Cheng Zhao Tu, Guoping Li*, Yunjun Luo, Tianfu Zhang
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
2
Citations
(Scopus)