Fracture behavior of PBX simulation subject to combined thermal and mechanical loads

Engineering

• Fracture Behavior 100%
• Mechanical Load 100%
• Main Reason 50%
• Binders 50%
• Digital Image Correlation 50%
• Creep 50%
• Fracture Mechanism 50%
• Interfacial Debonding 50%
• Cleavage Fracture 50%
• Correlation Method 50%
• Creep Property 50%
• Random Nature 50%
• Initial Damage 50%
• Temperature Creep 50%
• Filler Particle 50%
• Creep Strain 50%

Material Science

• Fracture Behavior 100%
• Creep 100%
• Creep Property 33%
• Debonding 33%
• Cleavage Fracture 33%