Fabrication of PS-DVB@Cu core-shell microsphere for anisotropic conductive adhesives by electroless plating with copper nanoparticles as seeds

Yuling Shi, Qing Liu, Qianqian Pan, Danlong Yang, Tao Wang*

*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

3 Citations (Scopus)

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Material Science

Chemical Engineering