Effects of nano-SiO2 particles addition on the microstructure, wettability, joint shear force and the interfacial IMC growth of Sn3.0Ag0.5Cu solder

Yong Wang, Xiuchen Zhao*, Xiaochen Xie, Yue Gu, Ying Liu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

43 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Effects of nano-SiO2 particles addition on the microstructure, wettability, joint shear force and the interfacial IMC growth of Sn3.0Ag0.5Cu solder'. Together they form a unique fingerprint.

Material Science

Chemical Engineering

Engineering