Effect of nano-Fe2O3 additions on wettability and interfacial intermetallic growth of low-Ag content Sn-Ag-Cu solders on Cu substrates

Yue Gu, Xiuchen Zhao*, Yi Li, Ying Liu, Yong Wang, Zhenyu Li

*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

118 Citations (Scopus)

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Material Science

Chemical Engineering