Fingerprint
Dive into the research topics of 'Effect of bump shape on current density and temperature distributions in solder bump joints under electromigration'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Effect of bump shape on current density and temperature distributions in solder bump joints under electromigration
Yi Li*, Xiuchen Zhao, Ying Liu, Hong Li
*Corresponding author for this work
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
5
Citations
(Scopus)