Effect of Bi addition on microstructures, properties and interfacial intermetallic compound growth of Low-Ag Sn-Cu lead-free solder

Yuan Wang, Xiu Chen Zhao*, Ying Liu, Jing Wei Cheng, Hong Li, Xiao Chen Xie

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

4 Citations (Scopus)

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Material Science