Fingerprint
Dive into the research topics of 'Direct Ag-Ag bonding by in-situ reduction of surface oxides for advanced chip-package interconnection'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Direct Ag-Ag bonding by in-situ reduction of surface oxides for advanced chip-package interconnection
Jiaqi Wu*, Yongjun Huo, Chin C. Lee
*Corresponding author for this work
Research output: Contribution to journal › Letter › peer-review
15
Citations
(Scopus)