Abstract
The effects of bump shape on the aging resistance and mechanical properties of Sn3.0Ag0.5Cu (SAC) solder bump joints were investigated by high-temperature aging test and shear test. Three different SAC solder bump joints with barrel type, cylinder type, and hourglass type, respectively, were provided by controlling solder process. The results indicate that as the bump volume decreases from barrel bump to hourglass bump in the reflow, the thickness growth rate of intermetallic compounds (IMCs) between different solder joints and Cu substrates in the isothermal aging of 150 °C decreases. And the change of shear strength of hourglass interconnection solder joint with the increase in temperature is the minimum in the three interconnection solder joints. Thus, as the solder dosage decreases properly, hourglass interconnection solder joint is obtained, which is avail to enhance the solder joint reliability at the high-temperature aging and the ability to adapt to the change of environment temperature suddenly.
| Original language | English |
|---|---|
| Pages (from-to) | 1-6 |
| Number of pages | 6 |
| Journal | Rare Metals |
| Volume | 40 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - Jan 2021 |
Keywords
- Bump shape
- Intermetallic compounds
- Lead-free solder
- Mechanical properties