βSn组织和晶粒取向对焊锡接头可靠性影响机理研究进展

Translated title of the contribution: Research Progress on the Influence Mechanisms of βSn Structure and Grain Orientation on the Reliabilities of Solder Joints

Ce Li, Bingguang Wang, Xufeng Chang, Zhaolong Ma*, Xingwang Cheng

*Corresponding author for this work

Research output: Contribution to journal › Review article › peer-review

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Material Science