Stiffness-Tunable Microstructures Based on Electrothermal Bimorph Beams

Lei Xiao, Yingtao Ding, Peng Wang, Hengzhang Yang, Huikai Xie

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

Robust and light-weighted microstructures are highly desired for various MEMS devices. Thin-film structures are light-weighted, but often suffer from low stiffness. In this abstract, a microstructure with tunable and enhanced stiffness is proposed for the first time. The stiffness-tunable microstructure is based on an electrothermal bimorph beam with an arched transverse cross-section. The concept, exemplified structure design and fabrication method of the proposed structure are presented. Both simulation and test results show that the stiffness of such a structure can be continuously changed more than 25 times by tuning the applied voltage from 0 to 7 V. This method provides a simple approach to stiffen thin-film microstructures.

源语言英语
主期刊名34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021
出版商Institute of Electrical and Electronics Engineers Inc.
79-82
页数4
ISBN(电子版)9781665419123
DOI
出版状态已出版 - 25 1月 2021
活动34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021 - Virtual, Gainesville, 美国
期限: 25 1月 202129 1月 2021

出版系列

姓名Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
2021-January
ISSN(印刷版)1084-6999

会议

会议34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021
国家/地区美国
Virtual, Gainesville
时期25/01/2129/01/21

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