摘要
We adopt simulation analysis on correlation mechanical characteristic of special electromechanical device support by using finite element technology. Analysis and check the modal shape, centroid displacement, absorbing load and stress distribution of this support. The result justify that the parameter setting and material selection accord with actual demand of that electromechanical device.
源语言 | 英语 |
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页(从-至) | 581-585 |
页数 | 5 |
期刊 | Procedia Engineering |
卷 | 16 |
DOI | |
出版状态 | 已出版 - 2011 |
活动 | International Workshop on Automobile, Power and Energy Engineering, APEE 2011 - Wuhan, 中国 期限: 15 4月 2011 → 17 4月 2011 |
指纹
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Luo, X., Luo, Q., Guo, Z., & Ding, Y. (2011). Simulation analysis on correlation mechanical characteristic of special electromechanical device support. Procedia Engineering, 16, 581-585. https://doi.org/10.1016/j.proeng.2011.08.1127