Simulation analysis on correlation mechanical characteristic of special electromechanical device support

Xiao Luo*, Qingsheng Luo, Zhen Guo, Yu Ding

*此作品的通讯作者

科研成果: 期刊稿件会议文章同行评审

摘要

We adopt simulation analysis on correlation mechanical characteristic of special electromechanical device support by using finite element technology. Analysis and check the modal shape, centroid displacement, absorbing load and stress distribution of this support. The result justify that the parameter setting and material selection accord with actual demand of that electromechanical device.

源语言英语
页(从-至)581-585
页数5
期刊Procedia Engineering
16
DOI
出版状态已出版 - 2011
活动International Workshop on Automobile, Power and Energy Engineering, APEE 2011 - Wuhan, 中国
期限: 15 4月 201117 4月 2011

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引用此

Luo, X., Luo, Q., Guo, Z., & Ding, Y. (2011). Simulation analysis on correlation mechanical characteristic of special electromechanical device support. Procedia Engineering, 16, 581-585. https://doi.org/10.1016/j.proeng.2011.08.1127