Simulation analysis on correlation mechanical characteristic of special electromechanical device support

Xiao Luo; Qingsheng Luo; Zhen Guo; Yu Ding

doi:10.1016/j.proeng.2011.08.1127

Simulation analysis on correlation mechanical characteristic of special electromechanical device support

Xiao Luo^*, Qingsheng Luo, Zhen Guo, Yu Ding

^*Corresponding author for this work

School of Computer Science and Technology

Beijing Institute of Technology

Research output: Contribution to journal › Conference article › peer-review

Abstract

We adopt simulation analysis on correlation mechanical characteristic of special electromechanical device support by using finite element technology. Analysis and check the modal shape, centroid displacement, absorbing load and stress distribution of this support. The result justify that the parameter setting and material selection accord with actual demand of that electromechanical device.

Original language	English
Pages (from-to)	581-585
Number of pages	5
Journal	Procedia Engineering
Volume	16
DOIs	https://doi.org/10.1016/j.proeng.2011.08.1127
Publication status	Published - 2011
Event	International Workshop on Automobile, Power and Energy Engineering, APEE 2011 - Wuhan, China Duration: 15 Apr 2011 → 17 Apr 2011

Keywords

Finite element technique
Mechanical characteristic
Simulation analysis
Support

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10.1016/j.proeng.2011.08.1127

Cite this

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title = "Simulation analysis on correlation mechanical characteristic of special electromechanical device support",

abstract = "We adopt simulation analysis on correlation mechanical characteristic of special electromechanical device support by using finite element technology. Analysis and check the modal shape, centroid displacement, absorbing load and stress distribution of this support. The result justify that the parameter setting and material selection accord with actual demand of that electromechanical device.",

keywords = "Finite element technique, Mechanical characteristic, Simulation analysis, Support",

author = "Xiao Luo and Qingsheng Luo and Zhen Guo and Yu Ding",

year = "2011",

doi = "10.1016/j.proeng.2011.08.1127",

language = "English",

volume = "16",

pages = "581--585",

journal = "Procedia Engineering",

issn = "1877-7058",

publisher = "Elsevier B.V.",

note = "International Workshop on Automobile, Power and Energy Engineering, APEE 2011 ; Conference date: 15-04-2011 Through 17-04-2011",

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TY - JOUR

T1 - Simulation analysis on correlation mechanical characteristic of special electromechanical device support

AU - Luo, Xiao

AU - Luo, Qingsheng

AU - Guo, Zhen

AU - Ding, Yu

PY - 2011

Y1 - 2011

N2 - We adopt simulation analysis on correlation mechanical characteristic of special electromechanical device support by using finite element technology. Analysis and check the modal shape, centroid displacement, absorbing load and stress distribution of this support. The result justify that the parameter setting and material selection accord with actual demand of that electromechanical device.

AB - We adopt simulation analysis on correlation mechanical characteristic of special electromechanical device support by using finite element technology. Analysis and check the modal shape, centroid displacement, absorbing load and stress distribution of this support. The result justify that the parameter setting and material selection accord with actual demand of that electromechanical device.

KW - Finite element technique

KW - Mechanical characteristic

KW - Simulation analysis

KW - Support

UR - http://www.scopus.com/inward/record.url?scp=84855717605&partnerID=8YFLogxK

U2 - 10.1016/j.proeng.2011.08.1127

DO - 10.1016/j.proeng.2011.08.1127

M3 - Conference article

AN - SCOPUS:84855717605

SN - 1877-7058

VL - 16

SP - 581

EP - 585

JO - Procedia Engineering

JF - Procedia Engineering

T2 - International Workshop on Automobile, Power and Energy Engineering, APEE 2011

Y2 - 15 April 2011 through 17 April 2011

ER -

Simulation analysis on correlation mechanical characteristic of special electromechanical device support

Abstract

Keywords

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