Performance Enhanced Thermal Flow Sensor with Novel Dual-Heater Structure Using CMOS Compatible Fabrication Process

Zhongyi Liu, Ruoqin Wang, Gai Yang, Xinyuan Zhang, Rui Jiao, Xuejiao Li, Jiali Qi, Hongyu Yu, Huikai Xie*, Xiaoyi Wang*

*此作品的通讯作者

科研成果: 书/报告/会议事项章节会议稿件同行评审

1 引用 (Scopus)

摘要

For the first time, a CMOS compatible calorimetric flow sensor with a dual-heater (DH) structure is proposed instead of using the traditional single-heater (SH) design. CFD simulation results demonstrated that the DH design can enhance the performance of the device with high sensitivity. Thereof, the DH sensor was fabricated with four suspended bridges and tested under three configuration modes: parallel-heater (PH) mode, full-bridge (FB) mode, and half-bridge (HB) mode. Experimental results demonstrated that the PH mode can achieve a high sensitivity of 403.25 mV/(m/s)/W, which is over 4 times that of the HB mode (83.7mV/(m/s)/W). This DH flow sensor under its PH mode can also provide an ultra large measurement range (±40 m/s) and fast response time (1.8 ms @16.7 m/s). The good performance of this novel flow sensor demonstrated its potential applications in respiration monitoring in medical areas and airflow control in HVAC systems for smart buildings.

源语言英语
主期刊名2023 IEEE 36th International Conference on Micro Electro Mechanical Systems, MEMS 2023
出版商Institute of Electrical and Electronics Engineers Inc.
267-270
页数4
ISBN(电子版)9781665493086
DOI
出版状态已出版 - 2023
活动36th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2023 - Munich, 德国
期限: 15 1月 202319 1月 2023

出版系列

姓名Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
2023-January
ISSN(印刷版)1084-6999

会议

会议36th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2023
国家/地区德国
Munich
时期15/01/2319/01/23

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