Parameters optimization of electroless deposition of Cu on Cr-coated diamond

A. R. Niazi, Shu Kui Li, Ying Chun Wang*, Jin Xu Liu, Zhi Yu Hu, Zahid Usman

*此作品的通讯作者

科研成果: 期刊稿件文章同行评审

14 引用 (Scopus)

摘要

Electroless copper plating on diamond particles precoated with 1% Cr was carried out to evaluate the effects of various experimental parameters on coating quality and deposition rate to obtain the optimized reaction parameters. The formulated samples under optimized parameters were characterized by X-ray diffraction, scanning electron microscopy, energy dispersive spectroscopy, X-ray photoelectron spectra and optical microscopy. The best parameters, where uniform and maximum coating thickness was achieved, are etching with 20% NaOH for 30 min, sensitization and activation with SnCl2 and PdCl 2 for 5 and 20 min, respectively. The composition of the copper solution bath was 16 g/L CuSO4·5H2O, 35 mL/L formaldehyde (HCHO), 23 g/L KNaC4H4O6 at 60 C, pH=13 and stirring at (350±15) r/min under ultrasonication.

源语言英语
页(从-至)136-145
页数10
期刊Transactions of Nonferrous Metals Society of China (English Edition)
24
1
DOI
出版状态已出版 - 1月 2014

指纹

探究 'Parameters optimization of electroless deposition of Cu on Cr-coated diamond' 的科研主题。它们共同构成独一无二的指纹。

引用此