Parameters optimization of electroless deposition of Cu on Cr-coated diamond

A. R. Niazi, Shu Kui Li, Ying Chun Wang*, Jin Xu Liu, Zhi Yu Hu, Zahid Usman

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

14 Citations (Scopus)

Abstract

Electroless copper plating on diamond particles precoated with 1% Cr was carried out to evaluate the effects of various experimental parameters on coating quality and deposition rate to obtain the optimized reaction parameters. The formulated samples under optimized parameters were characterized by X-ray diffraction, scanning electron microscopy, energy dispersive spectroscopy, X-ray photoelectron spectra and optical microscopy. The best parameters, where uniform and maximum coating thickness was achieved, are etching with 20% NaOH for 30 min, sensitization and activation with SnCl2 and PdCl 2 for 5 and 20 min, respectively. The composition of the copper solution bath was 16 g/L CuSO4·5H2O, 35 mL/L formaldehyde (HCHO), 23 g/L KNaC4H4O6 at 60 C, pH=13 and stirring at (350±15) r/min under ultrasonication.

Original languageEnglish
Pages (from-to)136-145
Number of pages10
JournalTransactions of Nonferrous Metals Society of China (English Edition)
Volume24
Issue number1
DOIs
Publication statusPublished - Jan 2014

Keywords

  • electroless copper plating Cr-coated diamond parameter optimization

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