TY - GEN
T1 - On the test method of dynamic characteristics of MEMS components
AU - He, Guang
AU - Wang, Yajun
AU - Ma, Wenrui
PY - 2013
Y1 - 2013
N2 - The paper developed a set of small split Hopkinson pressure/tensile bar testing system (SSHPB/SSHTB) to study the dynamic characteristics of the micro-electromechanical system (MEMS) material and components, by which the dynamic characteristics of MEMS nickel material and planar S-form micro-spring were got. The dynamic Young's modulus of LIGA nickel under the strain rate of 2×103s-1 got by the SSHPB is about 250GPa, which is slightly higher than that under static condition. The deformation peculiarity of the planar S-form micro-spring is also got by the SSHTB, which is uneven due to the spreading of the stress wave in the micro-spring. The result of the paper is valuable for providing feasible directions to the optimization design and manufacture of the MEMS components.
AB - The paper developed a set of small split Hopkinson pressure/tensile bar testing system (SSHPB/SSHTB) to study the dynamic characteristics of the micro-electromechanical system (MEMS) material and components, by which the dynamic characteristics of MEMS nickel material and planar S-form micro-spring were got. The dynamic Young's modulus of LIGA nickel under the strain rate of 2×103s-1 got by the SSHPB is about 250GPa, which is slightly higher than that under static condition. The deformation peculiarity of the planar S-form micro-spring is also got by the SSHTB, which is uneven due to the spreading of the stress wave in the micro-spring. The result of the paper is valuable for providing feasible directions to the optimization design and manufacture of the MEMS components.
KW - Dynamic mechanical characteristics
KW - High-speed image acquisition
KW - MEMS components
KW - Small split hopkinson pressure/tensile bar testing system
KW - Strain rate related
UR - http://www.scopus.com/inward/record.url?scp=84883661447&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/KEM.562-565.119
DO - 10.4028/www.scientific.net/KEM.562-565.119
M3 - Conference contribution
AN - SCOPUS:84883661447
SN - 9783037857397
T3 - Key Engineering Materials
SP - 119
EP - 124
BT - Micro-Nano Technology XIV
PB - Trans Tech Publications Ltd.
T2 - 14th Annual Conference and the 3rd International Conference of the Chinese Society of Micro-Nano Technology, CSMNT 2012
Y2 - 4 November 2012 through 7 November 2012
ER -