TY - GEN
T1 - Low-Cost Micro Predictive Mean Vote (PMV) Sensor and its Application for Smart Personal Ventilation Systems
AU - Izhar,
AU - Xu, Wei
AU - Wang, Xiaoyi
AU - Wang, Ruijie
AU - Lee, Yi Kuen
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/1
Y1 - 2019/1
N2 - We report a low-cost micro Predictive Mean Vote (PMV) sensor system for human thermal comfort with the improvement of measurement accuracy. The PMV sensor system consists of a Thermoresistive Micro Calorimetric Flow (TMCF) sensor, commercial temperature/relative humidity (RH) sensors and an MCU which can implement the PMV calculation based on ASHRAE Standard 55. Thanks to the excellent resolution (6 mm/s) and high accuracy (±27 mm/s) of the integrated TMCF sensor, the experimental results indicate that the accuracy of our PMV sensor (±0.03) is better than that of the commercial PMV meter (±0.04). Furthermore, a smart personal ventilation system (sPVS) is developed by using our proposed PMV sensor and a PID controlled cooling fan. By regulating the local airflow velocity, it is clear that our sPVS can provide both optimized thermal comfort and energy saving.
AB - We report a low-cost micro Predictive Mean Vote (PMV) sensor system for human thermal comfort with the improvement of measurement accuracy. The PMV sensor system consists of a Thermoresistive Micro Calorimetric Flow (TMCF) sensor, commercial temperature/relative humidity (RH) sensors and an MCU which can implement the PMV calculation based on ASHRAE Standard 55. Thanks to the excellent resolution (6 mm/s) and high accuracy (±27 mm/s) of the integrated TMCF sensor, the experimental results indicate that the accuracy of our PMV sensor (±0.03) is better than that of the commercial PMV meter (±0.04). Furthermore, a smart personal ventilation system (sPVS) is developed by using our proposed PMV sensor and a PID controlled cooling fan. By regulating the local airflow velocity, it is clear that our sPVS can provide both optimized thermal comfort and energy saving.
UR - http://www.scopus.com/inward/record.url?scp=85074374975&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2019.8870766
DO - 10.1109/MEMSYS.2019.8870766
M3 - Conference contribution
AN - SCOPUS:85074374975
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 841
EP - 844
BT - 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 32nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2019
Y2 - 27 January 2019 through 31 January 2019
ER -