@inproceedings{d63809df0895417e802f5275ab75641c,
title = "Enabling Low-k Liner in Ultra-high Aspect Ratio TSVs by the Timing of Vacuum Treatment in the Vacuum-assisted Spin-coating Technique",
abstract = "Through-silicon-vias (TSVs) with high aspect ratio and small diameter are highly desired for the miniaturization of high-density 3D heterogeneous integration system. In this paper, the low-cost and low-temperature vacuum-assisted spin-coating technique is deeply investigated to achieve continuous polyimide (PI) liner in ultra-high aspect ratio (>15:1) TSVs, and it is proved that the timing of vacuum treatment is the key enabler for this process. As a result, conformal PI liner is successfully deposited in TSVs with aspect ratio of 18:1 and diameter of 5 μm, and the step coverage is better than 25%. This optimized vacuum-assisted spin-coating technique provides a feasible and convenient solution to the formation of low-k liner in TSVs with ultra-high aspect ratio and small diameter.",
keywords = "3D integration, high aspect ratio, polyimide (PI) liner, through-silicon-via (TSV), vacuum treatment",
author = "Ziyue Zhang and Zhiming Chen and Baoyan Yang and Yigang Hao and Yuwen Su and Yingtao Ding",
note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 24th International Conference on Electronic Packaging Technology, ICEPT 2023 ; Conference date: 08-08-2023 Through 11-08-2023",
year = "2023",
doi = "10.1109/ICEPT59018.2023.10491985",
language = "English",
series = "2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023",
address = "United States",
}