Effect of silver powders on a low curing temperature silver conductive adhesive

Xiao Qing Wang*, Wei Ping Gan, Jian Zhou, Feng Xiang, Meng Long, Deng Er Peng

*此作品的通讯作者

科研成果: 期刊稿件文章同行评审

6 引用 (Scopus)

摘要

In this paper, some different types of epoxy electrical conductive adhesive (ECA) are prepared and investigated. Flake silver, spherical silver and the mixture of them are employed to fabricate ECA samples, respectively. With different percentage of filler loading, the morphology, adhesion, hardness, resistivity and differential scanning calorimeter (DSC) test of the silver filled ECA samples are compared and analyzed. By comparing the samples, it is found that the adhesion do not change a lot from each other. While in terms of hardness and resistivity, flake silver shows a better performance than spherical silver. The scanning electron microscopy figures of the ECA samples reveals that the mixed silvers have a better filler distribution and form a more dense conductive network than the single component—flake silver or spherical silver. Furthermore, when the ratio of flake silver to spherical silver reaches a suitable value, the ECA achieves the optimum electrical conductivity. Finally, the DSC test result shows the appropriate curing temperature for the ECAs.

源语言英语
页(从-至)18547-18552
页数6
期刊Journal of Materials Science: Materials in Electronics
29
21
DOI
出版状态已出版 - 1 11月 2018
已对外发布

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