TY - JOUR
T1 - Effect of silver powders on a low curing temperature silver conductive adhesive
AU - Wang, Xiao Qing
AU - Gan, Wei Ping
AU - Zhou, Jian
AU - Xiang, Feng
AU - Long, Meng
AU - Peng, Deng Er
N1 - Publisher Copyright:
© 2018, Springer Science+Business Media, LLC, part of Springer Nature.
PY - 2018/11/1
Y1 - 2018/11/1
N2 - In this paper, some different types of epoxy electrical conductive adhesive (ECA) are prepared and investigated. Flake silver, spherical silver and the mixture of them are employed to fabricate ECA samples, respectively. With different percentage of filler loading, the morphology, adhesion, hardness, resistivity and differential scanning calorimeter (DSC) test of the silver filled ECA samples are compared and analyzed. By comparing the samples, it is found that the adhesion do not change a lot from each other. While in terms of hardness and resistivity, flake silver shows a better performance than spherical silver. The scanning electron microscopy figures of the ECA samples reveals that the mixed silvers have a better filler distribution and form a more dense conductive network than the single component—flake silver or spherical silver. Furthermore, when the ratio of flake silver to spherical silver reaches a suitable value, the ECA achieves the optimum electrical conductivity. Finally, the DSC test result shows the appropriate curing temperature for the ECAs.
AB - In this paper, some different types of epoxy electrical conductive adhesive (ECA) are prepared and investigated. Flake silver, spherical silver and the mixture of them are employed to fabricate ECA samples, respectively. With different percentage of filler loading, the morphology, adhesion, hardness, resistivity and differential scanning calorimeter (DSC) test of the silver filled ECA samples are compared and analyzed. By comparing the samples, it is found that the adhesion do not change a lot from each other. While in terms of hardness and resistivity, flake silver shows a better performance than spherical silver. The scanning electron microscopy figures of the ECA samples reveals that the mixed silvers have a better filler distribution and form a more dense conductive network than the single component—flake silver or spherical silver. Furthermore, when the ratio of flake silver to spherical silver reaches a suitable value, the ECA achieves the optimum electrical conductivity. Finally, the DSC test result shows the appropriate curing temperature for the ECAs.
UR - http://www.scopus.com/inward/record.url?scp=85053386835&partnerID=8YFLogxK
U2 - 10.1007/s10854-018-9971-6
DO - 10.1007/s10854-018-9971-6
M3 - Article
AN - SCOPUS:85053386835
SN - 0957-4522
VL - 29
SP - 18547
EP - 18552
JO - Journal of Materials Science: Materials in Electronics
JF - Journal of Materials Science: Materials in Electronics
IS - 21
ER -