Determining thermal and mechanical properties of Polyimide using the DIC method

Tao Hua*, Huimin Xie, Bing Pan, Pengwan Chen, Qingming Zhang, Fenglei Huang

*此作品的通讯作者

科研成果: 期刊稿件会议文章同行评审

5 引用 (Scopus)

摘要

Polyimide (PI) is widely used in the aerospace and microelectronics industry and engineering due to its excellent electric and mechanical properties; however, the high thermal expansion of the PI causes the problem on the thermal expansion mismatching. A new type of PI with P-Phenylene diamine as diamine monomer is proposed to reduce the thermal expansion. The coefficient of thermal expansion (CTE) and the Young's module of this PI films are studied in this paper using DIC method. The CTE of the new type PI films is about 21×10-6/°C, which is greatly reduced. The successful results demonstrated the feasibility of DIC method to measure the thermal and mechanical properties of films.

源语言英语
文章编号737552
期刊Proceedings of SPIE - The International Society for Optical Engineering
7375
DOI
出版状态已出版 - 2009
活动International Conference on Experimental Mechanics 2008, ICEM 2008 - Nanjing, 中国
期限: 8 11月 20088 11月 2008

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Hua, T., Xie, H., Pan, B., Chen, P., Zhang, Q., & Huang, F. (2009). Determining thermal and mechanical properties of Polyimide using the DIC method. Proceedings of SPIE - The International Society for Optical Engineering, 7375, 文章 737552. https://doi.org/10.1117/12.839329