Determining thermal and mechanical properties of Polyimide using the DIC method

Tao Hua; Huimin Xie; Bing Pan; Pengwan Chen; Qingming Zhang; Fenglei Huang

doi:10.1117/12.839329

Determining thermal and mechanical properties of Polyimide using the DIC method

Tao Hua^*, Huimin Xie, Bing Pan, Pengwan Chen, Qingming Zhang, Fenglei Huang

^*Corresponding author for this work

Research output: Contribution to journal › Conference article › peer-review

5 Citations (Scopus)

Abstract

Polyimide (PI) is widely used in the aerospace and microelectronics industry and engineering due to its excellent electric and mechanical properties; however, the high thermal expansion of the PI causes the problem on the thermal expansion mismatching. A new type of PI with P-Phenylene diamine as diamine monomer is proposed to reduce the thermal expansion. The coefficient of thermal expansion (CTE) and the Young's module of this PI films are studied in this paper using DIC method. The CTE of the new type PI films is about 21×10^-6/°C, which is greatly reduced. The successful results demonstrated the feasibility of DIC method to measure the thermal and mechanical properties of films.

Original language	English
Article number	737552
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	7375
DOIs	https://doi.org/10.1117/12.839329
Publication status	Published - 2009
Event	International Conference on Experimental Mechanics 2008, ICEM 2008 - Nanjing, China Duration: 8 Nov 2008 → 8 Nov 2008

Keywords

CTE
DIC method
Mechanical properties
PI
Young's module

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10.1117/12.839329

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@article{4661e91973704281b44db24489c5ba25,

title = "Determining thermal and mechanical properties of Polyimide using the DIC method",

abstract = "Polyimide (PI) is widely used in the aerospace and microelectronics industry and engineering due to its excellent electric and mechanical properties; however, the high thermal expansion of the PI causes the problem on the thermal expansion mismatching. A new type of PI with P-Phenylene diamine as diamine monomer is proposed to reduce the thermal expansion. The coefficient of thermal expansion (CTE) and the Young's module of this PI films are studied in this paper using DIC method. The CTE of the new type PI films is about 21×10-6/°C, which is greatly reduced. The successful results demonstrated the feasibility of DIC method to measure the thermal and mechanical properties of films.",

keywords = "CTE, DIC method, Mechanical properties, PI, Young's module",

author = "Tao Hua and Huimin Xie and Bing Pan and Pengwan Chen and Qingming Zhang and Fenglei Huang",

year = "2009",

doi = "10.1117/12.839329",

language = "English",

volume = "7375",

journal = "Proceedings of SPIE - The International Society for Optical Engineering",

issn = "0277-786X",

publisher = "SPIE",

note = "International Conference on Experimental Mechanics 2008, ICEM 2008 ; Conference date: 08-11-2008 Through 08-11-2008",

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TY - JOUR

T1 - Determining thermal and mechanical properties of Polyimide using the DIC method

AU - Hua, Tao

AU - Xie, Huimin

AU - Pan, Bing

AU - Chen, Pengwan

AU - Zhang, Qingming

AU - Huang, Fenglei

PY - 2009

Y1 - 2009

N2 - Polyimide (PI) is widely used in the aerospace and microelectronics industry and engineering due to its excellent electric and mechanical properties; however, the high thermal expansion of the PI causes the problem on the thermal expansion mismatching. A new type of PI with P-Phenylene diamine as diamine monomer is proposed to reduce the thermal expansion. The coefficient of thermal expansion (CTE) and the Young's module of this PI films are studied in this paper using DIC method. The CTE of the new type PI films is about 21×10-6/°C, which is greatly reduced. The successful results demonstrated the feasibility of DIC method to measure the thermal and mechanical properties of films.

AB - Polyimide (PI) is widely used in the aerospace and microelectronics industry and engineering due to its excellent electric and mechanical properties; however, the high thermal expansion of the PI causes the problem on the thermal expansion mismatching. A new type of PI with P-Phenylene diamine as diamine monomer is proposed to reduce the thermal expansion. The coefficient of thermal expansion (CTE) and the Young's module of this PI films are studied in this paper using DIC method. The CTE of the new type PI films is about 21×10-6/°C, which is greatly reduced. The successful results demonstrated the feasibility of DIC method to measure the thermal and mechanical properties of films.

KW - CTE

KW - DIC method

KW - Mechanical properties

KW - PI

KW - Young's module

UR - http://www.scopus.com/inward/record.url?scp=77049128268&partnerID=8YFLogxK

U2 - 10.1117/12.839329

DO - 10.1117/12.839329

M3 - Conference article

AN - SCOPUS:77049128268

SN - 0277-786X

VL - 7375

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

M1 - 737552

T2 - International Conference on Experimental Mechanics 2008, ICEM 2008

Y2 - 8 November 2008 through 8 November 2008

ER -

Determining thermal and mechanical properties of Polyimide using the DIC method

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Keywords

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