@inproceedings{c6b7332e7a34409191df234724a2ed89,
title = "Design and Fabrication of an SOI Optical Switch with Backside Release for Anti-high-Overload",
abstract = "This paper presents a new method for wafer-level packaging of MEMS silicon-on-insulator (SOI) sensors and actuators working in the situation of over-loading. The developed process starts with backside deep reactive ion etching (DRIE) of the substrate to define the support structures as down stop blocks. This is followed by hydrofluoric acid etching to remove excessive SiO2 layer underneath the structural area to free the movable device parts. Then, another step of DRIE was applied on the device layer to form the device features. As the area of support structures are much smaller than proof mass, no stiction was observed. Finally, a glass wafer was used to encapsulate the switch using an anodic bonding technique to form a up stop block. In the work described here, the process is demonstrated for micromachining of an optical switch surviving from the high-impact overload environment at 20,000 g with pulse-width 120 μs.",
keywords = "Backside DRIE, High-impact overload, Optical switch",
author = "Jin Xie and Zhenhua Liu and Xiao Zhang and Jun Cao and Jun Dai and Chao Zeng",
note = "Publisher Copyright: {\textcopyright} The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd. 2024.; International Conference on Mechanical Design, ICMD 2023 ; Conference date: 20-10-2023 Through 22-10-2023",
year = "2024",
doi = "10.1007/978-981-97-0922-9_165",
language = "English",
isbn = "9789819709212",
series = "Mechanisms and Machine Science",
publisher = "Springer Science and Business Media B.V.",
pages = "2605--2613",
editor = "Jianrong Tan and Yu Liu and Hong-Zhong Huang and Jingjun Yu and Zequn Wang",
booktitle = "Advances in Mechanical Design - The Proceedings of the 2023 International Conference on Mechanical Design, ICMD 2023",
address = "Germany",
}