Construction of heat resistance devices for Escherichia coli and their application

Xiangying Sun; Yueqin Liu; Huan Sun; Haiyang Jia; Dazhang Dai; Chun Li

doi:10.3969/j.issn.0438-1157.2014.08.038

Construction of heat resistance devices for Escherichia coli and their application

Xiangying Sun, Yueqin Liu, Huan Sun, Haiyang Jia, Dazhang Dai, Chun Li^*

^*此作品的通讯作者

化学与化工学院

科研成果: 期刊稿件 › 文章 › 同行评审

2 引用（Scopus）

摘要

To improve the heat resistance of Escherichia coli, an inducible heat-resistance device T7-T.te-HSP20 and a constitutive heat-resistance device gapA-T. te-HSP20 based on T. te-HSP20 gene from Thermoanaerobacter tengcongensis MB4, and corresponding engineered strains E. coli-TH and E. coli-GH were constructed. The targeted protein was expressed in solubility after IPTG induction at 30℃ in E. coli-TH. Meanwhile, the survival rate of E. coli-TH was 3.2 times higher than the control at 50℃ for 30 min. The result of high-temperature fermentation showed that the optimum temperature range of E. coli-GH was broadened (37-43℃) under the regulation of heat resistance device gapA-T. te-HSP20. Stress resistance analysis showed that E. coli-GH not only possessed heat resistance and butanol resistance, but also had some resistance to acetic acid and ethanol. These results provide a new idea for modern microorganisms industry.

源语言	英语
页（从-至）	3128-3135
页数	8
期刊	Huagong Xuebao/CIESC Journal
卷	65
期	8
DOI	https://doi.org/10.3969/j.issn.0438-1157.2014.08.038
出版状态	已出版 - 1 8月 2014

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Sun, X., Liu, Y., Sun, H., Jia, H., Dai, D., & Li, C. (2014). Construction of heat resistance devices for Escherichia coli and their application. Huagong Xuebao/CIESC Journal, 65(8), 3128-3135. https://doi.org/10.3969/j.issn.0438-1157.2014.08.038

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title = "Construction of heat resistance devices for Escherichia coli and their application",

abstract = "To improve the heat resistance of Escherichia coli, an inducible heat-resistance device T7-T.te-HSP20 and a constitutive heat-resistance device gapA-T. te-HSP20 based on T. te-HSP20 gene from Thermoanaerobacter tengcongensis MB4, and corresponding engineered strains E. coli-TH and E. coli-GH were constructed. The targeted protein was expressed in solubility after IPTG induction at 30℃ in E. coli-TH. Meanwhile, the survival rate of E. coli-TH was 3.2 times higher than the control at 50℃ for 30 min. The result of high-temperature fermentation showed that the optimum temperature range of E. coli-GH was broadened (37-43℃) under the regulation of heat resistance device gapA-T. te-HSP20. Stress resistance analysis showed that E. coli-GH not only possessed heat resistance and butanol resistance, but also had some resistance to acetic acid and ethanol. These results provide a new idea for modern microorganisms industry.",

keywords = "Escherichia coli, Heat resistance, Heat shock protein (HSP), Stress resistance, Survival rate",

author = "Xiangying Sun and Yueqin Liu and Huan Sun and Haiyang Jia and Dazhang Dai and Chun Li",

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T1 - Construction of heat resistance devices for Escherichia coli and their application

AU - Sun, Xiangying

AU - Liu, Yueqin

AU - Sun, Huan

AU - Jia, Haiyang

AU - Dai, Dazhang

AU - Li, Chun

PY - 2014/8/1

Y1 - 2014/8/1

N2 - To improve the heat resistance of Escherichia coli, an inducible heat-resistance device T7-T.te-HSP20 and a constitutive heat-resistance device gapA-T. te-HSP20 based on T. te-HSP20 gene from Thermoanaerobacter tengcongensis MB4, and corresponding engineered strains E. coli-TH and E. coli-GH were constructed. The targeted protein was expressed in solubility after IPTG induction at 30℃ in E. coli-TH. Meanwhile, the survival rate of E. coli-TH was 3.2 times higher than the control at 50℃ for 30 min. The result of high-temperature fermentation showed that the optimum temperature range of E. coli-GH was broadened (37-43℃) under the regulation of heat resistance device gapA-T. te-HSP20. Stress resistance analysis showed that E. coli-GH not only possessed heat resistance and butanol resistance, but also had some resistance to acetic acid and ethanol. These results provide a new idea for modern microorganisms industry.

AB - To improve the heat resistance of Escherichia coli, an inducible heat-resistance device T7-T.te-HSP20 and a constitutive heat-resistance device gapA-T. te-HSP20 based on T. te-HSP20 gene from Thermoanaerobacter tengcongensis MB4, and corresponding engineered strains E. coli-TH and E. coli-GH were constructed. The targeted protein was expressed in solubility after IPTG induction at 30℃ in E. coli-TH. Meanwhile, the survival rate of E. coli-TH was 3.2 times higher than the control at 50℃ for 30 min. The result of high-temperature fermentation showed that the optimum temperature range of E. coli-GH was broadened (37-43℃) under the regulation of heat resistance device gapA-T. te-HSP20. Stress resistance analysis showed that E. coli-GH not only possessed heat resistance and butanol resistance, but also had some resistance to acetic acid and ethanol. These results provide a new idea for modern microorganisms industry.

KW - Escherichia coli

KW - Heat resistance

KW - Heat shock protein (HSP)

KW - Stress resistance

KW - Survival rate

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Construction of heat resistance devices for Escherichia coli and their application

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