Application of electronic speckle pattern interferometry in thermal expansion coefficient measurements

Si Ying Chen*, Chen Guang Huang, Jie Chen, Chun Kui Wang, Zhu Ping Duan

*此作品的通讯作者

科研成果: 期刊稿件文章同行评审

3 引用 (Scopus)

摘要

The thermal expansion coefficients of LY12 and 45 steel in different temperature-rising ratio are acquired by electronic speckle pattern interferometer (ESPI). For the pictures (300-500 frames) of each experiment, a batch processing code was designed to identify the central lines automatically instead of the old manual recognition. After displacements and real-time temperature measurements obtained, the thermal expansion coefficients can be deduced. It is proved that in the temperature-rising-ratio range concerned in this paper, the thermal expansion coefficients are almost independence on temperature-rising ratio, and at the same time, they increase within a narrow range when the temperature rises.

源语言英语
页(从-至)681-684
页数4
期刊Qiangjiguang Yu Lizishu/High Power Laser and Particle Beams
16
6
出版状态已出版 - 6月 2004

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