Application of electronic speckle pattern interferometry in thermal expansion coefficient measurements

Si Ying Chen*, Chen Guang Huang, Jie Chen, Chun Kui Wang, Zhu Ping Duan

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)

Abstract

The thermal expansion coefficients of LY12 and 45 steel in different temperature-rising ratio are acquired by electronic speckle pattern interferometer (ESPI). For the pictures (300-500 frames) of each experiment, a batch processing code was designed to identify the central lines automatically instead of the old manual recognition. After displacements and real-time temperature measurements obtained, the thermal expansion coefficients can be deduced. It is proved that in the temperature-rising-ratio range concerned in this paper, the thermal expansion coefficients are almost independence on temperature-rising ratio, and at the same time, they increase within a narrow range when the temperature rises.

Original languageEnglish
Pages (from-to)681-684
Number of pages4
JournalQiangjiguang Yu Lizishu/High Power Laser and Particle Beams
Volume16
Issue number6
Publication statusPublished - Jun 2004

Keywords

  • Electronic speckle pattern interferometry (ESPI)
  • Temperature-rising ratio
  • Thermal expansion coefficient

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