A liquid metal cooling system for the thermal management of high power LEDs

Yueguang Deng, Jing Liu*

*此作品的通讯作者

科研成果: 期刊稿件文章同行评审

165 引用 (Scopus)

摘要

An active cooling solution using liquid metal as the coolant was proposed for high power light emitting diodes (LEDs). The typical thermal-physical properties of liquid metal were presented. Then a series of experiments under different operation conditions were performed to evaluate the heat dissipation performance of the liquid metal cooling system, and the results were compared with that of water. In order to better understand the cooling capability of liquid metal cooling system, a theoretical thermal resistance model was established and discussed. Both the experiments and theoretical analysis indicated that liquid metal cooling was a powerful way for heat dissipation of high power LEDs, and the fabrication of practical liquid metal cooling devices was feasible and useful.

源语言英语
页(从-至)788-791
页数4
期刊International Communications in Heat and Mass Transfer
37
7
DOI
出版状态已出版 - 8月 2010
已对外发布

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