摘要
The 2.5D/3D packaging technology with silicon substrate interposer to achieve chip interconnection is a widely used packaging method, and its electromagnetic loss is a key issue affecting system integration. Taking a packaging structure based on a silicon substrate as the object, the silicon substrate was pre-processed by digging a cavity based on theoretical analysis. The electrical performance index of the packaging structure was obtained by modeling and simulating the structure. Finally, the structure was used to package a through line and a transceiver chip, and the actual electrical performance was verified. A low-loss, high-reliability packaging structure suitable for microwave and millimeter wave frequency bands is obtained.
| 投稿的翻译标题 | Research on Packaging Structure of Silicon-based Microwave and Millimeter Wave Transceiver Chip |
|---|---|
| 源语言 | 繁体中文 |
| 页（从-至） | 132-136 |
| 页数 | 5 |
| 期刊 | Guti Dianzixue Yanjiu Yu Jinzhan/Research and Progress of Solid State Electronics |
| 卷 | 41 |
| 期 | 2 |
| 出版状态 | 已出版 - 25 4月 2021 |
| 已对外发布 | 是 |
关键词
- Cavity
- Electromagnetic loss
- Packaging structure
- Silicon substrate