Abstract
The 2.5D/3D packaging technology with silicon substrate interposer to achieve chip interconnection is a widely used packaging method, and its electromagnetic loss is a key issue affecting system integration. Taking a packaging structure based on a silicon substrate as the object, the silicon substrate was pre-processed by digging a cavity based on theoretical analysis. The electrical performance index of the packaging structure was obtained by modeling and simulating the structure. Finally, the structure was used to package a through line and a transceiver chip, and the actual electrical performance was verified. A low-loss, high-reliability packaging structure suitable for microwave and millimeter wave frequency bands is obtained.
| Translated title of the contribution | Research on Packaging Structure of Silicon-based Microwave and Millimeter Wave Transceiver Chip |
|---|---|
| Original language | Chinese (Traditional) |
| Pages (from-to) | 132-136 |
| Number of pages | 5 |
| Journal | Guti Dianzixue Yanjiu Yu Jinzhan/Research and Progress of Solid State Electronics |
| Volume | 41 |
| Issue number | 2 |
| Publication status | Published - 25 Apr 2021 |
| Externally published | Yes |