Surface diffusion controlled reaction in small size microbumps

Yingxia Liu; Xiuyu Shi; Haoxiang Ren; Jian Cai; Xiuchen Zhao; Chengwen Tan; K. N. Tu

doi:10.1016/j.matlet.2020.129036

Surface diffusion controlled reaction in small size microbumps

Yingxia Liu^*, Xiuyu Shi, Haoxiang Ren, Jian Cai, Xiuchen Zhao, Chengwen Tan, K. N. Tu

^*Corresponding author for this work

School of Material Science and Engineering

Research output: Contribution to journal › Article › peer-review

9 Citations (Scopus)

Abstract

We made head-shaped Cu-Sn solder joints with diameters about 10 μm, 20 μm, and 50 μm and reflowed the samples at 240 °C, 260 °C, and 280 °C for 60 s to 600 s. In the 10 μm bumps, there is only one Cu₆Sn₅ grain after reflow, thus the classic model of scallop-type grain growth of Cu₆Sn₅ does not apply. Also, the grain growth in the small size bumps has the faster growth rate. We proposed a surface diffusion-controlled model to explain the new kinetics. According to our model, the diffusion activation energy is calculated to be Q_S = 0.18 ± 0.02 eV/atom and diffusion frequency factor to be D_S0 = 5.65 × 10⁻³ cm²/s.

Original language	English
Article number	129036
Journal	Materials Letters
Volume	284
DOIs	https://doi.org/10.1016/j.matlet.2020.129036
Publication status	Published - 1 Feb 2021

Keywords

3D IC
Grain boundaries
Interfaces
Intermetallic alloys and compounds
Lead-free solder
Surface diffusion kinetics

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10.1016/j.matlet.2020.129036

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title = "Surface diffusion controlled reaction in small size microbumps",

abstract = "We made head-shaped Cu-Sn solder joints with diameters about 10 μm, 20 μm, and 50 μm and reflowed the samples at 240 °C, 260 °C, and 280 °C for 60 s to 600 s. In the 10 μm bumps, there is only one Cu6Sn5 grain after reflow, thus the classic model of scallop-type grain growth of Cu6Sn5 does not apply. Also, the grain growth in the small size bumps has the faster growth rate. We proposed a surface diffusion-controlled model to explain the new kinetics. According to our model, the diffusion activation energy is calculated to be QS = 0.18 ± 0.02 eV/atom and diffusion frequency factor to be DS0 = 5.65 × 10−3 cm2/s.",

keywords = "3D IC, Grain boundaries, Interfaces, Intermetallic alloys and compounds, Lead-free solder, Surface diffusion kinetics",

author = "Yingxia Liu and Xiuyu Shi and Haoxiang Ren and Jian Cai and Xiuchen Zhao and Chengwen Tan and Tu, {K. N.}",

note = "Publisher Copyright: {\textcopyright} 2020 Elsevier B.V.",

year = "2021",

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doi = "10.1016/j.matlet.2020.129036",

language = "English",

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TY - JOUR

T1 - Surface diffusion controlled reaction in small size microbumps

AU - Liu, Yingxia

AU - Shi, Xiuyu

AU - Ren, Haoxiang

AU - Cai, Jian

AU - Zhao, Xiuchen

AU - Tan, Chengwen

AU - Tu, K. N.

PY - 2021/2/1

Y1 - 2021/2/1

N2 - We made head-shaped Cu-Sn solder joints with diameters about 10 μm, 20 μm, and 50 μm and reflowed the samples at 240 °C, 260 °C, and 280 °C for 60 s to 600 s. In the 10 μm bumps, there is only one Cu6Sn5 grain after reflow, thus the classic model of scallop-type grain growth of Cu6Sn5 does not apply. Also, the grain growth in the small size bumps has the faster growth rate. We proposed a surface diffusion-controlled model to explain the new kinetics. According to our model, the diffusion activation energy is calculated to be QS = 0.18 ± 0.02 eV/atom and diffusion frequency factor to be DS0 = 5.65 × 10−3 cm2/s.

AB - We made head-shaped Cu-Sn solder joints with diameters about 10 μm, 20 μm, and 50 μm and reflowed the samples at 240 °C, 260 °C, and 280 °C for 60 s to 600 s. In the 10 μm bumps, there is only one Cu6Sn5 grain after reflow, thus the classic model of scallop-type grain growth of Cu6Sn5 does not apply. Also, the grain growth in the small size bumps has the faster growth rate. We proposed a surface diffusion-controlled model to explain the new kinetics. According to our model, the diffusion activation energy is calculated to be QS = 0.18 ± 0.02 eV/atom and diffusion frequency factor to be DS0 = 5.65 × 10−3 cm2/s.

KW - 3D IC

KW - Grain boundaries

KW - Interfaces

KW - Intermetallic alloys and compounds

KW - Lead-free solder

KW - Surface diffusion kinetics

UR - http://www.scopus.com/inward/record.url?scp=85096709757&partnerID=8YFLogxK

U2 - 10.1016/j.matlet.2020.129036

DO - 10.1016/j.matlet.2020.129036

M3 - Article

AN - SCOPUS:85096709757

SN - 0167-577X

VL - 284

JO - Materials Letters

JF - Materials Letters

M1 - 129036

ER -

Surface diffusion controlled reaction in small size microbumps

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Keywords

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