TY - JOUR
T1 - Study on Microstructure of Pack-Borided GH4169 Alloy
AU - Tang, Jianguo
AU - Wang, Quansheng
N1 - Publisher Copyright:
© Published under licence by IOP Publishing Ltd.
PY - 2023
Y1 - 2023
N2 - The structure of the solid pack-boriding layer of nickel-based alloy is studied in this paper. The nickel-based alloy GH4169 was subjected to pack-boriding treatment at 850 °C and 950 °C, and the structure of the alloy boriding layer was studied. After the boriding treatment, a relatively continuous and uniform boriding layer was formed on the surface, which was mainly composed of nickel borides and chromium borides. The sample formed a layered structure of a boriding layer, diffusion zone, and substrate. After boriding treatment, Cr migrated to the surface to form CrB, Cr5B3, and Cr2B chromium borides, while Ni migrated to the lower part of the boriding layer to form Ni2B and Ni3B nickel borides.
AB - The structure of the solid pack-boriding layer of nickel-based alloy is studied in this paper. The nickel-based alloy GH4169 was subjected to pack-boriding treatment at 850 °C and 950 °C, and the structure of the alloy boriding layer was studied. After the boriding treatment, a relatively continuous and uniform boriding layer was formed on the surface, which was mainly composed of nickel borides and chromium borides. The sample formed a layered structure of a boriding layer, diffusion zone, and substrate. After boriding treatment, Cr migrated to the surface to form CrB, Cr5B3, and Cr2B chromium borides, while Ni migrated to the lower part of the boriding layer to form Ni2B and Ni3B nickel borides.
UR - http://www.scopus.com/inward/record.url?scp=85172724600&partnerID=8YFLogxK
U2 - 10.1088/1742-6596/2578/1/012039
DO - 10.1088/1742-6596/2578/1/012039
M3 - Conference article
AN - SCOPUS:85172724600
SN - 1742-6588
VL - 2578
JO - Journal of Physics: Conference Series
JF - Journal of Physics: Conference Series
IS - 1
M1 - 012039
T2 - 2023 3rd International Conference on Advanced Materials and Mechatronics, ICAMM 2023
Y2 - 12 May 2023 through 14 May 2023
ER -