Research survey of electroformed nickel material properties used in MEMS

Guozhong Li; Gengchen Shi; Li Sui; Futing Yi; Bo Wang

doi:10.4028/www.scientific.net/KEM.645-646.259

Research survey of electroformed nickel material properties used in MEMS

Guozhong Li, Gengchen Shi, Li Sui^*, Futing Yi, Bo Wang

^*Corresponding author for this work

School of Mechatronical Engineering

Research output: Contribution to journal › Article › peer-review

4 Citations (Scopus)

Abstract

As one of the significant structural materials used in safe and arming system of MEMS fuze, the research on micro-electroforming process technologies and micro-electroforming nickel's properties have been a popular field for MEMS area. This paper surveys present domestic and overseas research status of mechanical characterization of electroformed nickel, summarizes and analyzes that changes of the microstructure led by parameters of micro-electroforming process and the external environment make great effects.

Original language	English
Pages (from-to)	259-264
Number of pages	6
Journal	Key Engineering Materials
Volume	645
DOIs	https://doi.org/10.4028/www.scientific.net/KEM.645-646.259
Publication status	Published - 1 May 2015

Keywords

Electroformed nickel
Fuze
MEMS
Material properties

Access to Document

10.4028/www.scientific.net/KEM.645-646.259

Cite this

@article{04e0c8bee873467cbc4adbd0391de7d8,

title = "Research survey of electroformed nickel material properties used in MEMS",

abstract = "As one of the significant structural materials used in safe and arming system of MEMS fuze, the research on micro-electroforming process technologies and micro-electroforming nickel's properties have been a popular field for MEMS area. This paper surveys present domestic and overseas research status of mechanical characterization of electroformed nickel, summarizes and analyzes that changes of the microstructure led by parameters of micro-electroforming process and the external environment make great effects.",

keywords = "Electroformed nickel, Fuze, MEMS, Material properties",

author = "Guozhong Li and Gengchen Shi and Li Sui and Futing Yi and Bo Wang",

note = "Publisher Copyright: {\textcopyright} (2015) Trans Tech Publications, Switzerland.",

year = "2015",

month = may,

day = "1",

doi = "10.4028/www.scientific.net/KEM.645-646.259",

language = "English",

volume = "645",

pages = "259--264",

journal = "Key Engineering Materials",

issn = "1013-9826",

publisher = "Trans Tech Publications",

}

TY - JOUR

T1 - Research survey of electroformed nickel material properties used in MEMS

AU - Li, Guozhong

AU - Shi, Gengchen

AU - Sui, Li

AU - Yi, Futing

AU - Wang, Bo

N1 - Publisher Copyright: © (2015) Trans Tech Publications, Switzerland.

PY - 2015/5/1

Y1 - 2015/5/1

N2 - As one of the significant structural materials used in safe and arming system of MEMS fuze, the research on micro-electroforming process technologies and micro-electroforming nickel's properties have been a popular field for MEMS area. This paper surveys present domestic and overseas research status of mechanical characterization of electroformed nickel, summarizes and analyzes that changes of the microstructure led by parameters of micro-electroforming process and the external environment make great effects.

AB - As one of the significant structural materials used in safe and arming system of MEMS fuze, the research on micro-electroforming process technologies and micro-electroforming nickel's properties have been a popular field for MEMS area. This paper surveys present domestic and overseas research status of mechanical characterization of electroformed nickel, summarizes and analyzes that changes of the microstructure led by parameters of micro-electroforming process and the external environment make great effects.

KW - Electroformed nickel

KW - Fuze

KW - MEMS

KW - Material properties

UR - http://www.scopus.com/inward/record.url?scp=84944066005&partnerID=8YFLogxK

U2 - 10.4028/www.scientific.net/KEM.645-646.259

DO - 10.4028/www.scientific.net/KEM.645-646.259

M3 - Article

AN - SCOPUS:84944066005

SN - 1013-9826

VL - 645

SP - 259

EP - 264

JO - Key Engineering Materials

JF - Key Engineering Materials

ER -

Research survey of electroformed nickel material properties used in MEMS

Abstract

Keywords

Access to Document

Other files and links

Fingerprint

Cite this