Research on the mechanical properties and curing networks of energetic GAP/TDI binders

Song Ma, Yang Li, Yajin Li, Guoping Li, Yunjun Luo*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

15 Citations (Scopus)

Abstract

This research focused on correlations between the macroscopic mechanical performance and microstructures of energetic binders. Initially a series of glycidyl azide polymer (GAP)/toluene diisocyanate (TDI) binders, catalyzed by a mixture of dibutyltin dilaurate (DBTDL) and triphenyl bismuth (TPB), was prepared. Uniaxial tensile testing, and low-field nuclear magnetic resonance and infrared spectroscopy were then used to investigate the mechanical properties, curing networks, and hydrogen bonding (H-bonds) of these binders. Additionally, a novel method based on the molecular theory of elasticity and the statistical theory of rubber elasticity was used to analyze the integrity of the networks. The results showed that the curing parameter R strongly influences the mechanical properties and toughness of the binders, and that a tensile stress (σm) of 1.6 MPa and an elongation (εm) of 1041% was observed with an R value of 1.6. The cross-linking density increased sharply with the curing parameter, but only modestly with an R value ≥ 1.8. The proportion of H-bonds formed by the imino groups increased with the R value and reached 72.61% at an R value of 1.6, indicating a positive correlation between the H-bonds and σm. Molecular entanglement was demonstrated to increase with R and to contribute dramatically to the mechanical performance. The integrity of these networks, evaluated by a correction factor (A), varies with R, and a network of the GAP/TDI binder with an R value of 1.6 is desirable.

Original languageEnglish
Pages (from-to)708-725
Number of pages18
JournalCentral European Journal of Energetic Materials
Volume14
Issue number3
DOIs
Publication statusPublished - 2017

Keywords

  • Curing networks
  • Entanglement
  • Glycidyl azide polymer (GAP)
  • Hydrogen bonding
  • Integrity

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