Reduction of internal stress in InGaZnO (IGZO) thin film transistors by ultra-thin metal oxide layer

Shuo Zhang, Bin Liu, Xi Zhang, Congyang Wen, Haoran Sun, Xianwen Liu, Qi Yao, Xiaorui Zi, Zongchi Bao, Zijin Xiao, Yunsong Zhang, Guangcai Yuan, Jian Guo, Ce Ning, Dawei Shi, Feng Wang, Zhinong Yu*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)

Abstract

In this study, the modification of indium gallium zinc oxide (IGZO) thin-film transistors (TFTs) with an ultrathin metal oxide layer successfully reduces internal film stress. The introduction of an Al2O3 metal oxide layer effectively diminishes defects within the film and minimizes distortion in the film densification process. A low-temperature annealing process at 200 °C was employed to mitigate thermal expansion differences between the film and the substrate, thus reducing internal stress within the device. Furthermore, we have discovered that this structural modification holds the potential to enhance mechanical stress resistance. This paper offers a novel perspective and an experimental foundation for the stress analysis of flexible TFTs.

Original languageEnglish
Article number108093
JournalMaterials Science in Semiconductor Processing
Volume173
DOIs
Publication statusPublished - Apr 2024

Keywords

  • IGZO
  • Internal stress
  • Thin film transistors
  • Ultra-thin metal oxide layer

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