Abstract
Residual stress measurement is of critical significance to in-service security and the reliability of engineering components, and has been an active area of scientific interest. This paper offers a review of several prominent mechanical release methods for residual stress measurement and recent developments, focusing on the hole-drilling method combined with advanced optical sensing. Some promising trends for mechanical release methods are also analyzed.
Original language | English |
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Pages (from-to) | 570-583 |
Number of pages | 14 |
Journal | Acta Mechanica Solida Sinica |
Volume | 26 |
Issue number | 6 |
DOIs | |
Publication status | Published - Dec 2013 |
Keywords
- residual stress mechanical release method hole drilling moiré interferometry holography ESPI digital image correlation