Abstract
Through introducing the analytical solution of the transient heat conduction problem of the plate with convection into the thermal stress field model of the elastic plate, the stress reduction factor is presented explicitly in its dimensionless form. A new stress reduction factor is introduced for the purpose of comparison. The properties and appropriate conditions of the stress reduction factor, the first and second thermal shock resistance (TSR) parameters for the high and low Biot numbers, respectively, and the approximation formulas for the intermediate Biot number-interval are discussed. To investigate the TSR of ceramics more accurately, it is recommended to combine the heat transfer theory with the theory of thermoelasticity or fracture mechanics or use a numerical method. The critical rupture temperature difference and the critical rupture dimensionless time can be used to characterize the TSR of ceramics intuitively and legibly.
Original language | English |
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Pages (from-to) | 1351-1360 |
Number of pages | 10 |
Journal | Applied Mathematics and Mechanics (English Edition) |
Volume | 33 |
Issue number | 11 |
DOIs | |
Publication status | Published - Nov 2012 |
Externally published | Yes |
Keywords
- Biot number
- Ceramics
- Fourier number
- Stress reduction factor
- Thermal shock resistance (TSR) parameter