Precise assembly and joining of silver nanowires in three dimensions for highly conductive composite structures

Ying Liu*, Wei Xiong, Da Wei Li, Yao Lu, Xi Huang, Huan Liu, Li Sha Fan, Lan Jiang, Jean François Silvain, Yong Feng Lu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

47 Citations (Scopus)

Abstract

Three-dimensional (3D) electrically conductive micro/nanostructures are now a key component in a broad range of research and industry fields. In this work, a novel method is developed to realize metallic 3D micro/nanostructures with silver-thiol-acrylate composites via two-photon polymerization followed by femtosecond laser nanojoining. Complex 3D micro/nanoscale conductive structures have been successfully fabricated with ∼200 nm resolution. The loading of silver nanowires (AgNWs) and joining of junctions successfully enhance the electrical conductivity of the composites from insulating to 92.9 S m−1 at room temperature. Moreover, for the first time, a reversible switching to a higher conductivity is observed, up to ∼105 S m−1 at 523 K. The temperature-dependent conductivity of the composite is analyzed following the variable range hopping and thermal activation models. The nanomaterial assembly and joining method demonstrated in this study pave a way towards a wide range of device applications, including 3D electronics, sensors, memristors, micro/nanoelectromechanical systems, and biomedical devices, etc.

Original languageEnglish
Article number025001
JournalInternational Journal of Extreme Manufacturing
Volume1
Issue number2
DOIs
Publication statusPublished - Jun 2019

Keywords

  • Joining
  • Nanofabrication
  • Precise assembly
  • Silver nanowires
  • Three dimensional

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