Novel synthesizing and characterization of copper matrix composites reinforced with carbon nanotubes

Hu Wang, Zhao Hui Zhang, Hong Mei Zhang*, Zheng Yang Hu, Sheng Lin Li, Xing Wang Cheng

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

98 Citations (Scopus)

Abstract

In this study, we synthesized a novel copper matrix composites reinforced with carbon nanotubes (CNTs/Cu) by combination use of the electroless deposition (ED) and spark plasma sintering (SPS) methods. Firstly, a uniform copper layer was coated on the surface of carbon nanotubes (CNTs), then the CNTs/Cu composite powders containing different volume fractions of CNTs were obtained by mixing copper powder and copper coated CNTs. Finally, the CNTs/Cu composites were rapidly consolidated via SPS process. The powders and sintered composites were characterized using X-Ray diffraction (XRD), Raman spectroscopy, scanning electron microscopy (SEM), and transmission electron microscopy (TEM). Mechanical properties, Vickers hardness, and electrical conductivity of the CNTs/Cu composites were measured. The results indicated that the mechanical properties of CNTs/Cu composites were obviously improved due to the homogeneous dispersion of CNTs in the copper matrix and the formation of strong chemically bonded interfaces between CNTs and matrix. The CNTs/Cu composite containing 0.5 vol% CNTs has a maximum Vickers hardness of 1.3 GPa and highest yield strength of 142.2 MPa (which is increased by 150% compared with that of pure copper). In addition, the electrical conductivity of the composite was maintained at a high level of 90.9%IACS (International Annealed Copper Standard).

Original languageEnglish
Pages (from-to)80-89
Number of pages10
JournalMaterials Science and Engineering: A
Volume696
DOIs
Publication statusPublished - 1 Jun 2017

Keywords

  • Carbon nanotubes
  • Copper matrix composites
  • Electroless deposition
  • Interfacial bonding
  • Spark plasma sintering

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