Abstract
Curing process and curing kinetics of poly j 2,5-bis [(4-butyloxyphenyl) oxycarbonyl] styrene/epoxy resin/methyl tetrahydrophthalic anhydride, PBPCS/E-51/MeTHPA, systems were investigated by differential scanning calorimetry (DSC) using the non-isothermal method under different heating rates. Apparent activation energy of the curing systems was calculated by Kissinger method and Ozawa method respectively, and the reaction series were computed by means of Crane formula, then the kinetic equation was concluded. The results indicated that the curing process of the curing reactions followed the first order reaction, and the addition of PBPCS didn't change the curing mechanism of epoxy resin. So mesogen-jacketed liquid crystal polymers could be used for the modification research of epoxy resin. Based on the data of DSC, the optimized curing process of the curing systems is 90°C/2h→120°C/ 2h→140°C/1. 5h. The results would provide a theoretical basis for curing, performance test and application of PBPCS/E-51/MeTHPA systems, and for epoxy resins modified with mesogen-jacketed liquid crystal polymers.
Original language | English |
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Pages (from-to) | 1190-1196 |
Number of pages | 7 |
Journal | Acta Polymerica Sinica |
Issue number | 9 |
DOIs | |
Publication status | Published - 20 Sept 2013 |
Keywords
- Cure kinetics
- Epoxy resin
- Mesogen-jacked liquid crystal polymer
- Modify