Investigation on fracture behavior of ferroelectric ceramics under combined electromechanical combined loading by using a moiré interferometry technique

Q. D. Bing, D. N. Fang*

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

Abstract

This paper introduces how to in situ observe fracture behavior around crack tip in ferroelectric ceramics under combined electromechanical loading by use of a moiré interferometry technique. The deformation field induced by electric field concentration near crack tip in three-points bending experiments was measured. By analyzing the moiré interferometry images it is found that strain decreases faster than values predicted by the theoretical analysis as the distance away from the crack tip increases.

Original languageEnglish
Pages (from-to)205-208
Number of pages4
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume4537
DOIs
Publication statusPublished - 2001
Externally publishedYes
Event3th Conference on Experimental Mechanics - Beijing, China
Duration: 15 Oct 200117 Oct 2001

Keywords

  • Crack
  • Ferroelectric ceramics
  • Fracture
  • Moiré interferometry
  • Strain

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