TY - JOUR
T1 - Investigation of the morphology and structural transformation of 6H-SiC induced by a single femtosecond laser pulse
AU - Quan, Hongsheng
AU - Wang, Ruishi
AU - Li, Wang
AU - Zheng, Dezhi
AU - Zhao, Weiqian
AU - Wu, Zhonghuai
AU - Xu, Kemi
N1 - Publisher Copyright:
© 2024
PY - 2024/9
Y1 - 2024/9
N2 - Silicon carbide (SiC) is promising in semiconductor devices operating in extreme environments owing to its excellent properties including wide forbidden band, high thermal conductivity, thermal stability, chemical inertness, and high saturation rate. However, its Mohs hardness of 9 poses challenges for conventional machining techniques. Femtosecond laser processing offers an effective alternative for SiC processing, yet the underlying mechanism of interaction between laser pulse and SiC remains unclear. Herein we studied the mechanism of laser interacted with SiC, thoroughly investigated the structural transformation and morphology change of single crystal 6H-SiC induced by single ultrafast laser pulse irradiation at different pulse energies. The morphology changes of single pulse induced crater, i.e., diameter and depth, are characterized by scanning electron microscopy (SEM) and atomic force microscopy (AFM). The structural transformation and changes in the chemical composition are analyzed using micro-Raman spectroscopy. Moreover, the evolution of lattice arrangement is revealed by high-resolution transmission electron microscopy (TEM). At low pulse energies just above the modification threshold, the sample surface undergoes moderate modification, no larger craters and amorphous silicon are produced. At even higher energies, nonlinear absorption and ionization occur under ultrafast laser irradiation, the energy of the hot free electrons is transferred to the cold crystal lattice through electron–phonon scattering, causing a sharp increase in the lattice temperature. Si-C crystal bonds are broken and melting, resolidification and the generation of amorphous and crystalline silicon phase appeared.
AB - Silicon carbide (SiC) is promising in semiconductor devices operating in extreme environments owing to its excellent properties including wide forbidden band, high thermal conductivity, thermal stability, chemical inertness, and high saturation rate. However, its Mohs hardness of 9 poses challenges for conventional machining techniques. Femtosecond laser processing offers an effective alternative for SiC processing, yet the underlying mechanism of interaction between laser pulse and SiC remains unclear. Herein we studied the mechanism of laser interacted with SiC, thoroughly investigated the structural transformation and morphology change of single crystal 6H-SiC induced by single ultrafast laser pulse irradiation at different pulse energies. The morphology changes of single pulse induced crater, i.e., diameter and depth, are characterized by scanning electron microscopy (SEM) and atomic force microscopy (AFM). The structural transformation and changes in the chemical composition are analyzed using micro-Raman spectroscopy. Moreover, the evolution of lattice arrangement is revealed by high-resolution transmission electron microscopy (TEM). At low pulse energies just above the modification threshold, the sample surface undergoes moderate modification, no larger craters and amorphous silicon are produced. At even higher energies, nonlinear absorption and ionization occur under ultrafast laser irradiation, the energy of the hot free electrons is transferred to the cold crystal lattice through electron–phonon scattering, causing a sharp increase in the lattice temperature. Si-C crystal bonds are broken and melting, resolidification and the generation of amorphous and crystalline silicon phase appeared.
KW - Femtosecond laser processing
KW - Silicon carbide
KW - Structural transformation
UR - http://www.scopus.com/inward/record.url?scp=85190799650&partnerID=8YFLogxK
U2 - 10.1016/j.optlastec.2024.111015
DO - 10.1016/j.optlastec.2024.111015
M3 - Article
AN - SCOPUS:85190799650
SN - 0030-3992
VL - 176
JO - Optics and Laser Technology
JF - Optics and Laser Technology
M1 - 111015
ER -