High temperature digital image correlation evaluation of in-situ failure mechanism: An experimental framework with application to C/SiC composites

W. G. Mao*, J. Chen, M. S. Si, R. F. Zhang, Q. S. Ma, D. N. Fang, X. Chen

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

30 Citations (Scopus)

Abstract

A high temperature digital image correlation (DIC) technique was developed, which was applied to study the in-situ fracture behavior of a carbon fibre reinforced silicon carbide matrix (C/SiC) composite. The displacement distribution and cracking information of the C/SiC single edge notched beam specimen can be monitored real-time, thanks to the improved DIC technique with special speckle patterns that can reach up to 1600 °C. The results showed that the brittle to ductile transition temperature of C/SiC composites is about 1300 °C. The new failure mechanisms of C/SiC composites at different experimental temperatures were further verified with the aid of X-ray diffraction and scanning electron microscope (SEM) techniques. In addition, the relationships between the fracture toughness, first-crack strength of C/SiC composites and environmental temperature were deduced. The proposed experimental method and testing results may shed some light on assessing the reliability and durability of C/SiC composites at high temperatures.

Original languageEnglish
Pages (from-to)26-34
Number of pages9
JournalMaterials Science and Engineering: A
Volume665
DOIs
Publication statusPublished - 17 May 2016
Externally publishedYes

Keywords

  • Brittle to ductile transition
  • C/SiC composites
  • Digital image correlation
  • High-temperature testing
  • Mechanical properties

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