Fabrication and heat transfer characteristics of C/SiC pyramidal core lattice sandwich panel

Kai Wei; Rujie He; Xiangmeng Cheng; Yongmao Pei; Rubing Zhang; Daining Fang

doi:10.1016/j.applthermaleng.2015.02.012

Fabrication and heat transfer characteristics of C/SiC pyramidal core lattice sandwich panel

Kai Wei, Rujie He, Xiangmeng Cheng, Yongmao Pei, Rubing Zhang^*, Daining Fang

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

70 Citations (Scopus)

Abstract

Lightweight C/SiC pyramidal core lattice sandwich panel was proposed and fabricated for potential applications as hot structure and thermal protection system (TPS). The heat transfer characteristics of C/SiC lattice sandwich panel were measured from 600 to 1150 °C through an aerodynamic heating simulation experimental system. Temperature distribution on the back surface of the lattice sandwich panel was obtained through periodical thermocouple assignment. Heat insulation effects under different temperatures were also investigated. Finally, a three dimensional finite element simulation model was built to calculate the heat transfer of the C/SiC lattice sandwich panel. The equivalent thermal conductivity of the C/SiC lattice sandwich panel varied from 1.98 to 4.95 W/(m °C) when the front surface temperature increased from 600 to 1150 °C. It is believed that these results can provide a foundational understanding on the heat transfer characteristics of C/SiC lattice sandwich panel.

Original language	English
Pages (from-to)	10-17
Number of pages	8
Journal	Applied Thermal Engineering
Volume	81
DOIs	https://doi.org/10.1016/j.applthermaleng.2015.02.012
Publication status	Published - 25 Apr 2015
Externally published	Yes

Keywords

C/SiC lattice sandwich panel
Equivalent thermal conductivity
Finite element simulation
Heat transfer

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10.1016/j.applthermaleng.2015.02.012

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title = "Fabrication and heat transfer characteristics of C/SiC pyramidal core lattice sandwich panel",

abstract = "Lightweight C/SiC pyramidal core lattice sandwich panel was proposed and fabricated for potential applications as hot structure and thermal protection system (TPS). The heat transfer characteristics of C/SiC lattice sandwich panel were measured from 600 to 1150 °C through an aerodynamic heating simulation experimental system. Temperature distribution on the back surface of the lattice sandwich panel was obtained through periodical thermocouple assignment. Heat insulation effects under different temperatures were also investigated. Finally, a three dimensional finite element simulation model was built to calculate the heat transfer of the C/SiC lattice sandwich panel. The equivalent thermal conductivity of the C/SiC lattice sandwich panel varied from 1.98 to 4.95 W/(m °C) when the front surface temperature increased from 600 to 1150 °C. It is believed that these results can provide a foundational understanding on the heat transfer characteristics of C/SiC lattice sandwich panel.",

keywords = "C/SiC lattice sandwich panel, Equivalent thermal conductivity, Finite element simulation, Heat transfer",

author = "Kai Wei and Rujie He and Xiangmeng Cheng and Yongmao Pei and Rubing Zhang and Daining Fang",

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T1 - Fabrication and heat transfer characteristics of C/SiC pyramidal core lattice sandwich panel

AU - Wei, Kai

AU - He, Rujie

AU - Cheng, Xiangmeng

AU - Pei, Yongmao

AU - Zhang, Rubing

AU - Fang, Daining

PY - 2015/4/25

Y1 - 2015/4/25

N2 - Lightweight C/SiC pyramidal core lattice sandwich panel was proposed and fabricated for potential applications as hot structure and thermal protection system (TPS). The heat transfer characteristics of C/SiC lattice sandwich panel were measured from 600 to 1150 °C through an aerodynamic heating simulation experimental system. Temperature distribution on the back surface of the lattice sandwich panel was obtained through periodical thermocouple assignment. Heat insulation effects under different temperatures were also investigated. Finally, a three dimensional finite element simulation model was built to calculate the heat transfer of the C/SiC lattice sandwich panel. The equivalent thermal conductivity of the C/SiC lattice sandwich panel varied from 1.98 to 4.95 W/(m °C) when the front surface temperature increased from 600 to 1150 °C. It is believed that these results can provide a foundational understanding on the heat transfer characteristics of C/SiC lattice sandwich panel.

AB - Lightweight C/SiC pyramidal core lattice sandwich panel was proposed and fabricated for potential applications as hot structure and thermal protection system (TPS). The heat transfer characteristics of C/SiC lattice sandwich panel were measured from 600 to 1150 °C through an aerodynamic heating simulation experimental system. Temperature distribution on the back surface of the lattice sandwich panel was obtained through periodical thermocouple assignment. Heat insulation effects under different temperatures were also investigated. Finally, a three dimensional finite element simulation model was built to calculate the heat transfer of the C/SiC lattice sandwich panel. The equivalent thermal conductivity of the C/SiC lattice sandwich panel varied from 1.98 to 4.95 W/(m °C) when the front surface temperature increased from 600 to 1150 °C. It is believed that these results can provide a foundational understanding on the heat transfer characteristics of C/SiC lattice sandwich panel.

KW - C/SiC lattice sandwich panel

KW - Equivalent thermal conductivity

KW - Finite element simulation

KW - Heat transfer

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VL - 81

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Fabrication and heat transfer characteristics of C/SiC pyramidal core lattice sandwich panel

Abstract

Keywords

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