Effect of adding Ag to the medium entropy SnBiIn alloy on intermetallic compound formation

Li Pu; Yingxia Liu; Yong Yang; Quanfeng He; Ziqing Zhou; Xiuchen Zhao; Chengwen Tan; K. N. Tu

doi:10.1016/j.matlet.2020.127891

Effect of adding Ag to the medium entropy SnBiIn alloy on intermetallic compound formation

Li Pu, Yingxia Liu^*, Yong Yang, Quanfeng He, Ziqing Zhou, Xiuchen Zhao, Chengwen Tan, K. N. Tu

^*Corresponding author for this work

School of Material Science and Engineering

Research output: Contribution to journal › Article › peer-review

12 Citations (Scopus)

Abstract

Wetting reactions of the medium entropy alloy of SnBiIn and SnBiInAg on Cu substrate have been investigated. The melting points of both SnBiIn and SnBiInAg are about 80 °C. The reactions were performed at 120 °C, 140 °C, and 160 °C. The kinetics of interfacial intermetallic compound (IMC) growth of Cu₆Sn₅ was studied to be ripening-controlled with activation energy about 11.1 kJ/mol for SnBiIn and 10.4 kJ/mol for SnBiInAg. However, the addition of Ag has effectively reduced the IMC growth by 20–30%. We propose that it is because Ag has reduced the pre-factor of diffusivity by increasing the entropy of the alloy.

Original language	English
Article number	127891
Journal	Materials Letters
Volume	272
DOIs	https://doi.org/10.1016/j.matlet.2020.127891
Publication status	Published - 1 Aug 2020

Keywords

Electronic materials
Interface
Kinetics
Lead-free solder
Microstructure

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10.1016/j.matlet.2020.127891

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title = "Effect of adding Ag to the medium entropy SnBiIn alloy on intermetallic compound formation",

abstract = "Wetting reactions of the medium entropy alloy of SnBiIn and SnBiInAg on Cu substrate have been investigated. The melting points of both SnBiIn and SnBiInAg are about 80 °C. The reactions were performed at 120 °C, 140 °C, and 160 °C. The kinetics of interfacial intermetallic compound (IMC) growth of Cu6Sn5 was studied to be ripening-controlled with activation energy about 11.1 kJ/mol for SnBiIn and 10.4 kJ/mol for SnBiInAg. However, the addition of Ag has effectively reduced the IMC growth by 20–30%. We propose that it is because Ag has reduced the pre-factor of diffusivity by increasing the entropy of the alloy.",

keywords = "Electronic materials, Interface, Kinetics, Lead-free solder, Microstructure",

author = "Li Pu and Yingxia Liu and Yong Yang and Quanfeng He and Ziqing Zhou and Xiuchen Zhao and Chengwen Tan and Tu, {K. N.}",

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T1 - Effect of adding Ag to the medium entropy SnBiIn alloy on intermetallic compound formation

AU - Pu, Li

AU - Liu, Yingxia

AU - Yang, Yong

AU - He, Quanfeng

AU - Zhou, Ziqing

AU - Zhao, Xiuchen

AU - Tan, Chengwen

AU - Tu, K. N.

PY - 2020/8/1

Y1 - 2020/8/1

N2 - Wetting reactions of the medium entropy alloy of SnBiIn and SnBiInAg on Cu substrate have been investigated. The melting points of both SnBiIn and SnBiInAg are about 80 °C. The reactions were performed at 120 °C, 140 °C, and 160 °C. The kinetics of interfacial intermetallic compound (IMC) growth of Cu6Sn5 was studied to be ripening-controlled with activation energy about 11.1 kJ/mol for SnBiIn and 10.4 kJ/mol for SnBiInAg. However, the addition of Ag has effectively reduced the IMC growth by 20–30%. We propose that it is because Ag has reduced the pre-factor of diffusivity by increasing the entropy of the alloy.

AB - Wetting reactions of the medium entropy alloy of SnBiIn and SnBiInAg on Cu substrate have been investigated. The melting points of both SnBiIn and SnBiInAg are about 80 °C. The reactions were performed at 120 °C, 140 °C, and 160 °C. The kinetics of interfacial intermetallic compound (IMC) growth of Cu6Sn5 was studied to be ripening-controlled with activation energy about 11.1 kJ/mol for SnBiIn and 10.4 kJ/mol for SnBiInAg. However, the addition of Ag has effectively reduced the IMC growth by 20–30%. We propose that it is because Ag has reduced the pre-factor of diffusivity by increasing the entropy of the alloy.

KW - Electronic materials

KW - Interface

KW - Kinetics

KW - Lead-free solder

KW - Microstructure

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DO - 10.1016/j.matlet.2020.127891

M3 - Article

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SN - 0167-577X

VL - 272

JO - Materials Letters

JF - Materials Letters

M1 - 127891

ER -

Effect of adding Ag to the medium entropy SnBiIn alloy on intermetallic compound formation

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Keywords

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