Dynamic conducting crack propagation in piezoelectric materials: Mode-II problem

Hao Sen Chen, Wei Yi Wei, Jin Xi Liu*, Dai Ning Fang

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

7 Citations (Scopus)

Abstract

This paper studies the dynamic conducting crack propagation in piezoelectric solids under suddenly in-plane shear loading. Based on the integral transform methods and the Wiener-Hopf technique, the resulting mixed boundary value problem is solved. The analytical solutions of the dynamic stress intensity factor and dynamic electric displacement intensity factor for the Mode II case are derived. Furthermore, the numerical results are presented to illustrate the characteristics of the dynamic crack propagation. It is shown that the universal functions for the dynamic stress and electric displacement intensity factors vanish if the crack propagation speed equals the generalized Rayleigh speed. The results indicate that the defined electro-mechanical coupling coefficient is of great importance to the universal functions and stress intensity factor history.

Original languageEnglish
Pages (from-to)769-774
Number of pages6
JournalScience China Technological Sciences
Volume58
Issue number5
DOIs
Publication statusPublished - 1 May 2015
Externally publishedYes

Keywords

  • conducting crack
  • dynamic crack propagation
  • dynamic intensity factors
  • in-plane shear loading
  • piezoelectric materials

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