Advanced Electronic Packaging Technology: From Hard to Soft

Yue Gu; Yongjun Huo

doi:10.3390/ma16062346

Advanced Electronic Packaging Technology: From Hard to Soft

Yue Gu, Yongjun Huo^*

^*Corresponding author for this work

School of Material Science and Engineering

Research output: Contribution to journal › Editorial

10 Citations (Scopus)

Original language	English
Article number	2346
Journal	Materials
Volume	16
Issue number	6
DOIs	https://doi.org/10.3390/ma16062346
Publication status	Published - Mar 2023

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10.3390/ma16062346

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Gu, Y., & Huo, Y. (2023). Advanced Electronic Packaging Technology: From Hard to Soft. Materials, 16(6), Article 2346. https://doi.org/10.3390/ma16062346

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Advanced Electronic Packaging Technology: From Hard to Soft

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